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Genma, with the advanced equipments and more than 500 people working on the production line, work towards the idea of “ Guarantee quality on hand to ensure it when flowing to the next process”, implementing strictly the rule of “No defect” in order to ensure the quality of products.
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Main technical parameter |
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Material |
FR-4,CEM-3,CEM-1 |
Max. Layer |
12L Sample 20L |
Max. Panel Size |
570mm×490mm |
Overall Thickness |
0.4mm-5.0mm |
Min. line Wide |
0.1mm Sample 0.075mm |
Min. Line Space |
0.1mm Sample 0.075mm |
Distance between conductor and board line |
0.3mm |
Distance between hole and board line |
0.5mm |
Min. Through Hole Size |
0.15mm |
PTH Wall Thickness |
0.025mm |
PTH Hole Dia. Tolerance |
±0.076mm |
NPTH Hole Dia. Tolerance |
±0.05mm |
Hole Position Deviation |
±0.05mm |
Min. pitch? |
0.15mm |
Profiling |
Puch ,CNC ,Stamp hole,V-CUT |
Surface Finishing |
ENIG(Electroless nickel immersion gold), Chemical nickel immersion gold, Gold finger, Anti-oxidant |
Special Process |
Blind hole, buried hole, lead open hole, fill hole, carbon-oil, impedance controls |
Solder Mask |
Liquid Photoimagible Solder Mask |
Min. solder mask width |
0.1mm |
Min. solder mask bridge |
0.075mm |
Width of unmasked area between pad and masked area |
0.1mm |
Lead time for tool |
3day(common); 7day(complexed) |
tool life |
300,000 hits to 500,000 hits |
Max. test points |
16,000 points |
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